OKAMOTO晶圓減薄GNX200BP研磨機(jī)



OKAMOTO晶圓減薄GNX200BP研磨機(jī)概要
GNX200BP Wafer Grinding is a fully automatic continuous downfeed grinding machine. Wafers are handled through the machine by a robot, and load/unload arms. Two different stations are used for wafer cleaning after the final grind station. Chuck speed, grinding wheel, and grind spindle downfeed rate speeds can be used to manipulate grinder throughput, surface finish, and wheel life. A two-point in-process gauge measuring system controls wafer thickness under grind spindles 1 and 2. A three-point grind spindle angle adjustment mechanism is utilized for easily maintaining wafer profile (ttv); with the option a motorized adjustment. After completion at the grind station, the wafer transfers to Polish unit automatically. The local polishing unit removes subsurface damage for increased wafer die strength, and the ability to handle final thickness of 50 microns.
GNX200BP晶圓研磨機(jī)是一款全自動(dòng)的連續(xù)向下進(jìn)給研磨機(jī)。晶圓由機(jī)械手通過(guò)機(jī)器進(jìn)行處理，并裝載/卸載臂,。在最終研磨站之后,，使用兩個(gè)不同的站進(jìn)行晶片清潔?？ūP轉(zhuǎn)速,，砂輪轉(zhuǎn)速和砂輪主軸下降速度可以用來(lái)控制砂輪的產(chǎn)量，表面光潔度和砂輪壽命,。兩點(diǎn)制程量規(guī)測(cè)量系統(tǒng)控制磨削主軸1和2下的晶片厚度,。三點(diǎn)磨削主軸角度調(diào)節(jié)機(jī)構(gòu)用于輕松保持晶片輪廓（ttv）；可選配電動(dòng)調(diào)節(jié)裝置,。在研磨站完成后,，晶片將自動(dòng)轉(zhuǎn)移到拋光單元。局部拋光單元消除了表面下的損壞,，從而提高了晶片的芯片強(qiáng)度,，并具有處理50微米最終厚度的能力。



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OKAMOTO晶圓減薄GNX200BP研磨機(jī)相關(guān)產(chǎn)品：
衡鵬供應(yīng)
OKAMOTO GDM300晶圓研磨/晶圓減薄/晶圓拋光/晶圓背拋/Wafer Grinding